Field-Emission Scanning Electron Microscopy (FE-SEM)

Scientists in Charge

Dr. Pilar Aranda (Senior Scientist)

Dr. Miguel A. Camblor (Research Professor)

Technician

Ismael Ballesteros (permanent staff)

Contact

+34 913349000 ext. 437386
+34 91766520 (direct number)

Location

Lab S37 (basement)

Measurements

High-resolution images with surface topography information.
Quantitative chemical microanalysis by Energy Dispersive Spectroscopy (EDS). Mapping

Equipment

Field-Emission Scanning Electron Microscopy (FE-SEM)

FEI Nova NanoSEM 230 microscope with a Schottky field-emission gun that allows visualization of samples at high (HV) and low (LV) vacuum (< 200 Pa) at variable potential (50 V to 30 kV) and with the possibility of decelerating the electron beam. Previous metalization is not required even for non-conductive samples using the low-vacuum option. The equipment incorporates several detectors: secondary electrons (SE) Everhart-Thornley for HV (SED), low vacuum SE (LVD), through the lens SE (TLD), backscatter electrons (BSE), through the lens (TLD-BSE), ultrahigh resolution low vacuum SED (Helix) as well as a new generation detector for high contrast imaging at low potentials in both HV and LV combining SE and BSE (vCD).
Quantitative chemical analysis with a new generation EDX detector (EDAX Genesis XM2i) that allows identification of elements with atomic number ≥ 5 (Boro) and resolution till 133 eV. Imaging by element is also possible (chemical mapping).
There are sample holders of different kinds, including special ones for cross-sectional views.

Allowed samples

Any kind of samples of a size small enough to enter into the microscope chamber (<10cm). The samples must be and remain completely dry and must be stable under the electron beam. Typically, no metallization is required if working at low voltage with the vCD detector.

Maintenance

A series of adjustments and calibrations are performed weekly in accordance with the equipment manufacturer's specifications. These include electron beam and lens alignment, focus modulation, astigmatism corrector alignment, image shift correction and crossover calibration. These procedures are also documented in the equipment manual.